Silicon Ion Trap
Joe Britton (NIST)

Microphotography
Silicon ion trap midway through fabrication process. This image is looking through a channel cut all the way through a silicon wafer by deep reactive ion etch (DRIE). The bottom of the channel shows photoresist squeezed between a backing wafer and a 1.1 micron layer of oxide deposited on the back of the etched wafer. The needle-like structures are silicon fragments which are artifacts of the DRIE process.